Introduction：

The development of SMT technology has a history of more than ten years. At present, its application will further develop in the field of assembly technology represented by high-density assembly and three-dimensional assembly, from wearable consumer electronics to innovative automotive electronics to aerospace and military electronics. The development of these industries is inseparable from SMT technology. In addition, the SMT production line is developing in the direction of a flexible production environment with information integration. The high-end electronics manufacturing industry has put forward higher quality control requirements for SMT equipment and processes in terms of complexity, accuracy, process and specifications. What novel solutions are there to deal with these new challenges? This will be the focus of this forum. 

Previous Speech Companies:

Previous Audience：

Foxconn | Jabil | Flex | Konka | HikVision | Bosch|  Continental | Harman | Huawei| Apple | Oppo | Transsion | Xiaomi | Sim | Ericsson | ZTE | USI | Pegatron

Topics:

•Based on different industries (such as automotive electronics, aerospace electronics, military electronics) functional module types and welding process requirements

•Application of high-end inspection equipment (AOI/X-ray, etc.) in the field of electronic manufacturing

•The new development of SiP leads to a new challenge for SMT

•Virtual optimization and manufacturing evaluation based on digital twin

•Application schemes for reducing energy consumption in electronic product manufacturing

•Experience sharing of flexible electronic intelligent manufacturing cases