2023Electronics Intelligent Manufacturing and Cutting-edge Technology Summit Forum

Shanghai New International Expo Centre(SNIEC)


The development of SMT technology has a history of more than ten years. At present, its application will further develop in the field of assembly technology represented by high-density assembly and three-dimensional assembly, from wearable consumer electronics to innovative automotive electronics to aerospace and military electronics. The development of these industries is inseparable from SMT technology. In addition, the SMT production line is developing in the direction of a flexible production environment with information integration. The high-end electronics manufacturing industry has put forward higher quality control requirements for SMT equipment and processes in terms of complexity, accuracy, process and specifications. What novel solutions are there to deal with these new challenges? This will be the focus of this forum. 

Previous Speech Companies:

Previous Audience:

Foxconn | Jabil | Flex | Konka | HikVision | Bosch|  Continental | Harman | Huawei| Apple | Oppo | Transsion | Xiaomi | Sim | Ericsson | ZTE | USI | Pegatron


•Based on different industries (such as automotive electronics, aerospace electronics, military electronics) functional module types and welding process requirements

•Application of high-end inspection equipment (AOI/X-ray, etc.) in the field of electronic manufacturing

•The new development of SiP leads to a new challenge for SMT

•Virtual optimization and manufacturing evaluation based on digital twin

•Application schemes for reducing energy consumption in electronic product manufacturing

•Experience sharing of flexible electronic intelligent manufacturing cases


•If you are interested in the above topics, please sign up for the forum and prepare your own speech title and content based on the above topics.

•Submission of speech materials: Chinese and English speech titles, guest profiles and photos, and 250-word speech abstracts.

•Application Deadline: March 10, 2023

•Speech PPT Submission Deadline: April 7, 2023


  • 2023Electronics Intelligent Manufacturing and Cutting-edge Technology Summit Forum

Time Topic Guest
Time TopicOpening Speech by the Moderator Guest

Time TopicDevelopment and Challenges of Assembly/Packaging Technology for RF Applications Guest

Yunqian Song
Institute of Microelectronics, Chinese Academy of Sciences Ph.D

Time TopicHow to Realize the Digital Transformation of Electronic Manufacturing Using IPC Standards Guest

Jinshan Li
IPC Standards Development Manager

Time TopicWhy digital? Guest

Assembly Technology of ZTE Assembly Technology Manufacturing Engineering Research Institute Chief Engineer

Time TopicLunch Break Guest

Time TopicMulti-series Inspection Equipment to help Zero-defect Production Guest

Xiaoyong Pang
Viscom Sales Manager of South China

Time TopicElectronic manufacturing small batch multi-variety PCBA test automation solution Guest

Tan Jun
Flextronics Electronic Technology (Suzhou) Co., Ltd. Manager of Automation Development Department

Time TopicUltra-miniature EtherCAT stand-alone controller, in-depth scene to turn complex into professional! Guest

Mingcong Sun
ADVANTECH Product Manager of Industrial IoT Business Group

Time TopicDesign and implementation of flexible PCBA and assembly line automation solutions Guest

Ye Qing
Phoenix Asia Pacific Electric (Nanjing) Co., Ltd. Director of PS Regional Business Department and Industrial Electronics Manufacturing Department

Messe München GmbH


81823 München

Tel: +49 89 949-20720
Fax: +49 89 949-20729

MMI (Shanghai) Co., Ltd.

11th floor, GC Tower, 1088 Yuanshen Rd


Tel: +86 21 2020 5500
Fax: +86 21 2020 5688