The development of SMT technology has a history of more than ten years. At present, its application will further develop in the field of assembly technology represented by high-density assembly and three-dimensional assembly, from wearable consumer electronics to innovative automotive electronics to aerospace and military electronics. The development of these industries is inseparable from SMT technology. In addition, the SMT production line is developing in the direction of a flexible production environment with information integration. The high-end electronics manufacturing industry has put forward higher quality control requirements for SMT equipment and processes in terms of complexity, accuracy, process and specifications. What novel solutions are there to deal with these new challenges? This will be the focus of this forum.
Previous Speech Companies:
Foxconn | Jabil | Flex | Konka | HikVision | Bosch| Continental | Harman | Huawei| Apple | Oppo | Transsion | Xiaomi | Sim | Ericsson | ZTE | USI | Pegatron
•Based on different industries (such as automotive electronics, aerospace electronics, military electronics) functional module types and welding process requirements
•Application of high-end inspection equipment (AOI/X-ray, etc.) in the field of electronic manufacturing
•The new development of SiP leads to a new challenge for SMT
•Virtual optimization and manufacturing evaluation based on digital twin
•Application schemes for reducing energy consumption in electronic product manufacturing
•Experience sharing of flexible electronic intelligent manufacturing cases
•If you are interested in the above topics, please sign up for the forum and prepare your own speech title and content based on the above topics.
•Submission of speech materials: Chinese and English speech titles, guest profiles and photos, and 250-word speech abstracts.
•Application Deadline: March 10, 2023
•Speech PPT Submission Deadline: April 7, 2023
2023Electronics Intelligent Manufacturing and Cutting-edge Technology Summit Forum
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|Time||TopicHow to Realize the Digital Transformation of Electronic Manufacturing Using IPC Standards||
Assembly Technology of ZTE Assembly Technology Manufacturing Engineering Research Institute Chief Engineer
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|Time||TopicElectronic manufacturing small batch multi-variety PCBA test automation solution||
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|Time||TopicDesign and implementation of flexible PCBA and assembly line automation solutions||