Introduction:

The rapid development of the 5G era drives all walks of life forward. Communication modules, as a key link connecting the Internet of Things industry, have become the competition field for major companies. Modern electronic products are developing in the direction of short, small, light, thin and high reliability, high speed, high performance and low cost. Especially in mobile and portable electronic products, as well as aerospace, medical and other fields, the volume and weight requirements of products are becoming more and more stringent. In order to adapt to this development trend, "encapsulation" and "assembly" are developing toward the intersection. The 2022 Munich Shanghai Electronic Production Equipment Exhibition will create a "5G, AIoT new era, drive the development of SiP packaging and micro-assembly technology theme forum" and invite industry heavyweight guests to discuss the latest cutting-edge developments in the future of electronic manufacturing.

Enterprises to be Invited:

• Institute of Microelectronics, Chinese Academy of Sciences

• China Semiconductor Industry Association

• Huajin Semiconductor Packaging Pilot Technology R&D Center Co., Ltd.

• Jiangsu Changdian Technology Co., Ltd.

• Beijing CETC Electronic Equipment Co., Ltd.

• Guangdong Shengyi Technology Co., Ltd.

Previous Audience:

We will invite OSAT, IDM, fabless semiconductor companies, silicon wafer foundries, consumer electronics, 5G/communication, AI, Internet of Things, automotive electronics and other popular smart terminal fields EMS/OEM/ODM and material and equipment supply Merchants are here.

Topics:

•Current Situation and Challenges of System-in-Package Technology

•Development and application of new technologies, new equipment, new materials, and new processes

•Device-level packaging, circuit module-level assembly, micro-component and micro-system-level assembly