SiP Packaging and Micro Assembly Industrial Innovation, Upgrading and Industrial Integration Summit Forum

Shanghai New International Expo Centre(SNIEC)


The rapid development of the 5G era drives all walks of life forward. Communication modules, as a key link connecting the Internet of Things industry, have become the competition field for major companies. Modern electronic products are developing in the direction of short, small, light, thin and high reliability, high speed, high performance and low cost. Especially in mobile and portable electronic products, as well as aerospace, medical and other fields, the volume and weight requirements of products are becoming more and more stringent. In order to adapt to this development trend, "encapsulation" and "assembly" are developing toward the intersection. The 2022 Munich Shanghai Electronic Production Equipment Exhibition will create a "5G, AIoT new era, drive the development of SiP packaging and micro-assembly technology theme forum" and invite industry heavyweight guests to discuss the latest cutting-edge developments in the future of electronic manufacturing.

Enterprises to be Invited:

  • Institute of Microelectronics, Chinese Academy of Sciences

  • China Semiconductor Industry Association

  • Huajin Semiconductor Packaging Pilot Technology R&D Center Co., Ltd.

  • Jiangsu Changdian Technology Co., Ltd.

  • Beijing CETC Electronic Equipment Co., Ltd.

  • Guangdong Shengyi Technology Co., Ltd.

Previous Audience:

We will invite OSAT, IDM, fabless semiconductor companies, silicon wafer foundries, consumer electronics, 5G/communication, AI, Internet of Things, automotive electronics and other popular smart terminal fields EMS/OEM/ODM and material and equipment supply Merchants are here.


•Current Situation and Challenges of System-in-Package Technology

•Development and application of new technologies, new equipment, new materials, and new processes

•Device-level packaging, circuit module-level assembly, micro-component and micro-system-level assembly

• If you are interested in the above topics, please sign up for the forum and prepare your own speech title and content based on the above topics.

•Submission of speech materials: Chinese and English speech titles, guest profiles and photos, and 250-word speech abstracts.

•Application Deadline: March 10, 2023

•Speech PPT Submission Deadline: April 7, 2023


  • SiP Packaging and Micro-assembly Industry Innovation and upgrading and Indusrtial Integration Summit Forum

Time Topic Guest
Time TopicMorning Meeting Sign-in Guest

Time TopicOpening Speech by the Moderator Guest

Time TopicLeader's Speech Guest

Xiekang Yu
The National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance Vice President

Time TopicIndustry Market Report Guest

Shiuh-Kao Chiang

Time TopicFOPLP Meets New Challenges and New Opportunities Guest

Tingyu Lin
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Chief Scientist

Time TopicCoffee Break(15 minutes) Guest

Time TopicRDL's Innovative Production Line Guest

Weiquan Jian
Manz Automation Deputy General Manager of Sales

Time TopicApplication of Advanced Packaging in Optoelectronic Technology Guest

Steve Jin
OIP Technology Singapore General Manager

Time TopicAfternoon Meeting Sign-in Guest

Time TopicProgress in Fan-out System Integration Technology Guest

Daping Yao
Jiangsu CAS Microelectronics Integration Technology Co Ltd Chairman, General Manager

Time TopicAdvanced Packaging Technology for RF Applications Guest

Daquan Yu
Xiamen Sky Semiconductor Co.Ltd. CEO

Time TopicTBF Thermal Curing Interlayer Insulation Material Technology Sharing Guest

Miyoshi Tadahiro
Taiyo Holdings Co., Ltd Deputy General Manager

Time TopicCoffee Break(15 minutes) Guest

Time TopicLaser Debonding Technology in Advanced Packaging Guest

Zhenan Tang
Guangdong Honhor Semiconductor Equipment Co., Ltd. Chief of Technology Strategy

Time TopicFan-out Panel-level System-integrated Packaging Technology Guest

Yan Huo
SIPLP Microelectronics(Chongqing)Limited R & D Director

Time TopicDomestic WLCSP, PLP Advanced Packaging and Testing Equipment Process and Solutions Guest

Shuangcheng Chen
Huav Technology Co., Ltd. General Manager

Time TopicThe Full Day Meeting Ends Guest

Messe München GmbH


81823 München

Tel: +49 89 949-20720
Fax: +49 89 949-20729

MMI (Shanghai) Co., Ltd.

11th floor, GC Tower, 1088 Yuanshen Rd


Tel: +86 21 2020 5500
Fax: +86 21 2020 5688