Precise Dispensing and Adhesive Innovation Application Conference

Shanghai New International Expo Centre(SNIEC)

Introduction:

With the rapid development of 3C electronics, semiconductors and other industries in recent years, it has promoted a new round of growth engines in the dispensing market. In this wave, the 3C electronics industry has become a big stage for dispensing equipment to exert its fists. The data shows that the annual compound growth rate of China's 3C industry dispensing equipment market recent years has reached about 24%, and it is expected to achieve an industrial scale of 4.2 billion by 2024, and the application market has broad prospects. For dispensing equipment, this means that only products with high speed, high precision and high reliability can be favored by downstream customers. At productronica China you will find numerous precision dispensing equipment and fluid kits, as well as insight into the technology trends and innovative solutions of adhesives and dispensing technology in the electronics industry.


Previous Speech Companies:


Previous Audience:

Huawei | Xiaomi | SONY  | ASUS | Dell | Ericsson  TCL | Midea | ZTE | Samsung | Shanghai Aerospace Electronic and Communication Equipment Research Institute |Shuyuan Mobile Communication | TDG-tech limited company | Great Wall |  Yanfeng Visteon Electronic 


Topics:

•The technical development trend and status quo of adhesives and dispensing technology in the electronics industry

•The development trend and status quo of visual dispensing technology

•Glue and dispensing technology facilitate 5G and advanced packaging

•Adhesives and dispensing technology in automotive electronics, portable devices (smartphones, tablets, wearable devices, etc.) and communications industry development trends, case sharing and challenges

•Technical category: underfill, encapsulation, heat conduction, electrical conductivity, potting, reinforcement, narrow gap dispensing, sprue inspection, plasma surface treatment, etc.

 


• If you are interested in the above topics, please sign up for the forum and prepare your own speech title and content based on the above topics.

•Submission of speech materials: Chinese and English speech titles, guest profiles and photos, and 250-word speech abstracts.

•Application Deadline: March 10, 2023

•Speech PPT Submission Deadline: April 7, 2023

 

  • Precise Dispensing and Adhesive Innovation Application Conference

Time Topic Guest
Time TopicCheck in Guest

Time TopicThe Opening Speech of the Representative of the Organizer Guest

Time TopicThermal Conductive Gel Technology and Application Guest

Xingcheng Luo
Chengdu Taly Technology Co., Ltd. General Manager

Time TopicTechinno Innovative TIM Solutions at System Level Guest

Bing Han
Suzhou Techinno New Material Technologies Co., Ltd. CTO

Time TopicHenkel PCM & Durable coating Microtim material application in Datacenter Guest

Ben Chen
Henkel China Business Development Manager of Telecom&Datacom

Time Topic3M Electronics Sustainable Design Adhesive Solution Guest

Junxing Peng
3M Application Engineer

Time TopicApplications and Glue Solutions in Optical Communications by Shenzhen IboxTech Guest

Haihong Wang
Ibox Tech Sales Manager

Time TopicLunch Break Guest

Time TopicDesign and Application of Dual Curing Adhesives Guest

Bing Huang
Kangda New Materials Group Co.,Ltd Vice Chief Engineer /PhD

Time TopicSeayu Productsand And Their Applications in Consumer Electronics Guest

Andrew Xia
Yantai Seayu New Materials Corp.,Ltd. Product Manager

Time TopicBonding Solutions for Micro Acoustic Components Guest

Qianjie Zhu
MIRACLE LINK Project Directo

Time TopicFree Discussion Guest

Messe München GmbH

Messegelände

81823 München

Tel: +49 89 949-20720
Fax: +49 89 949-20729
info@messe-muenchen.de

MMI (Shanghai) Co., Ltd.

11th floor, GC Tower, 1088 Yuanshen Rd

Shanghai

Tel: +86 21 2020 5500
Fax: +86 21 2020 5688
info@mm-sh.com