Supporting program

Our forums, conferences, presentations of application examples and panel discussions will give you additional momentum and background information on the fair's interesting topics like electronic manufacturing, SMT, automation, wire harness manufacturing, printed electronics and adhesive move the electronics manufacturing industry. At productronica China, you will find answers to your questions on these and other topics.

  • China International SiP Forum

    China International SiP Forum will kick off on March 19, 2020 at the Shanghai New International Expo Center, On-site Forum Area, Hall C5.
    In recent years, system-level packaging requirements are getting higher and higher, and technical means are constantly updated. The conference will invite terminal equipment manufacturers, EMS, IC packaging companies and upstream and downstream experts of SiP industry to discuss the application and prospect of SiP in EMS.

    Organizer: Messe Muenchen Shanghai Co., Ltd. Moore Elite

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  • China Electronics Intelligent Manufacturing Equipment & Process Innovation Forum

    China Electronics Intelligent Manufacturing Equipment & Process Innovation Forum will kick off on March 18, 2020 at the Shanghai New International Expo Center, Room M17, 2nd Floor, E2 Hall.
    After several years of rapid development, China's electronics manufacturing industry is in an important period of transition to fully automated production. With the largest scale of intelligent manufacturing market demand in the world, the new era of electronic manufacturing from automation and informationization to intelligent manufacturing 4.0 has arrived.

    Organizer: Messe Muenchen Shanghai

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  • China Electronics Manufacturing Automation Innovation Forum

    China Electronics Manufacturing Automation Innovation Forum will kick off on March 19, 2020 at the Shanghai New International Expo Center, On-site Forum Area, Hall C1.
    China's electronics manufacturing industry is in the process of transition from semi-automation to automation, and it is urgent to improve the level of information technology and intelligence, and accelerate the pace of intelligent manufacturing, becoming an urgent task for China's electronics manufacturing industry. Whether manufacturing in China is going global, whether electronic manufacturing companies can successfully complete industrial upgrading and independent innovation is the core competitiveness that can truly survive at the top of the world industry in the future! Stay tuned for the 2019 China Electronics Manufacturing Automation and Intelligence Forum, where you will find the answer!

    Theme: Electronics manufacturing 4.0, the Smart Factory

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  • International Flexible & Printed Electronics Forum

    International Flexible & Printed Electronics Forum will kick off on March 18, 2020 at the Shanghai New International Expo Center, Room M32, 2nd Floor, E5 Hall.
    Making sensors by printing or based on flexible substrates are the new paradigms of electronic manufacturing. Flexible, printable and wearable electronics, so far rather uncommon terms in the electronics community, are becoming highly interesting topics.

    Organizer: Messe Muenchen Shanghai Co., Ltd.

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  • International Dispensing & Adhesive Technology Innovation Forum

    International Connector Innovation Forum will be held on March 19, 2020 at the Shanghai New International Exhibition Centre, Room M1, Hall W1. The conference will discuss Adhesive and dispensing technology trends and the current status in the electronics industry; New adhesive and dispensing technology development; Case study and the challenge of adhesive and dispensing technology in automotive electronics, portable equipment (smart phone, tablet, wearable devices and etc.) and communication industry; Adhesive and dispensing empower advanced-packaging; Adhesive technology: underhill, conformal coating, encapsulation, thermal conductivity, electrical conductivity, potting, dispensing and plasma surface treatment (plasma, corona) and etc.

    Organizer: Messe München Shanghai Co., Ltd.

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  • International Wire Harness Advanced Manufacturing Innovation Forum

    International Wire Harness Advanced Manufacturing Innovation Forum will kick off on March 18, 2020 at the Shanghai New International Expo Center, On-site Forum Area, Hall C5.
    Discuss on the hot topics like wire harness production revolution led by Industry 4.0, the trend of customized cable processing solution, the opportunities and challenges of wiring harness industry from new energy vehicles, and so on.

    Organizer: Messe Muenchen Shanghai Co., Ltd.

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  • IPC CFX Conference

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