- Date: July 4, 2020
- Venue: On-site Forum in Hall 5.1, National Exhibition and Convention Center（Shanghai）
- Organizer: Messe München Shanghai Co., Ltd.
- Scale: 300+
- Adhesive and Dispensing Technology Trends and the Current Status in the Electronics Industry
- Adhesive and Dispensing Empower Advanced-packaging
- Case Study and the Challenge of Adhesive and Dispensing Technology in Automotive Electronics, Portable Equipment (Smart Phone, Tablet, Wearable Devices and etc.) and Communication Industry
- Adhesive Technology: Underhill, Conformal Coating, Encapsulation, Thermal Conductivity, Electrical Conductivity, Potting, Dispensing and Plasma Surface Treatment (Plasma, Corona) and etc.
2019 Audience Analysis (Based on 321 Audience)
2019 Partial Audience Sample List
Huawei · Ericsson · FiberHome · Hisense Communication · Axis Communications ·
Simcom · Bosch · CRRC Times · Webasto · RoboSense · Comnex Signal · Goertek ·
CSMC Technologies · Micro-power System · HIGHLY New Energy · Hanwha Q CELLS ·
Hikvision · Weiya Technology · Foxconn · Tech-Front Computer · Flextronics · Enics Electronics
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