International Dispensing & Adhesive Technology Innovation Forum

On-site Forum Area B in Hall 5.1, National Exhibition and Convention Center(Shanghai)

General Information

  • Date: July 4, 2020
  • Venue:  On-site Forum Area B in Hall 5.1, National Exhibition and Convention Center(Shanghai)
  • Organizer: Messe München Shanghai Co., Ltd.
  • Scale: 300+

Topics

  • Adhesive and Dispensing Technology Trends and the Current Status in the Electronics Industry
  • Adhesive and Dispensing Empower Advanced-packaging
  • Case Study and the Challenge of Adhesive and Dispensing Technology in Automotive Electronics, Portable Equipment (Smart Phone, Tablet, Wearable Devices and etc.) and Communication Industry
  • Adhesive Technology: Underhill, Conformal Coating, Encapsulation, Thermal Conductivity, Electrical Conductivity, Potting, Dispensing and Plasma Surface Treatment (Plasma, Corona) and etc.

2019 Audience Analysis (Based on 321 Audience)


2019 Partial Audience Sample List

Huawei · Ericsson · FiberHome · Hisense Communication · Axis Communications ·

Simcom · Bosch · CRRC Times · Webasto · RoboSense · Comnex Signal · Goertek ·

CSMC Technologies · Micro-power System · HIGHLY New Energy · Hanwha Q CELLS ·

Hikvision · Weiya Technology · Foxconn · Tech-Front Computer · Flextronics · Enics Electronics


Previous Review


Photos


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