IPC CEMAC 2020

IPC CEMAC as the most influential IPC annual large-scale comprehensive electronics industry event, successfully concluded its first session with the support of customers and members. In order to better build the IPC CEMAC event and provide customers and members with a better communication platform, the second IPC CEMAC China Electronics Manufacturing Annual Conference in 2020 will be jointly created by IPC and Munich Shanghai Electronics Production Equipment Exhibition, on March 2nd - 5th, the Munich Shanghai Electronic Production Equipment Exhibition was held in Shanghai at the same time, and it is expected to attract hundreds of enterprises and member units to participate in it. IPC has 1100+ members in China, of which 40% are members in East China, and 70% are well-known companies.

Organizer: IPC--Association Connecting Electronics Industries Messe München Shanghai Co., Ltd.

International Smart Manufacturing Ecosystem Summit 2020

Smart Manufacturing combines various hardware, software and data technologies to optimize the manufacturing process. Moving from traditional automation towards fully connected, integrated and flexible systems, smart factories nowadays change the entire manufacturing ecosystems—how products are designed, manufactured, shipped, deployed and maintained. Additionally, changes in consumer behavior bring new challenges to every player.

Join us in this international summit together with other professionals to learn and discuss how smart manufacturing influences every aspect of business. Be part of an eye opening event with keynote speeches and panel discussions led by industry leaders providing you a platform to gain valuable insights. Listen to the top leading companies sharing their challenges and management strategies and then network with the industry giants and exchange your experience during the summit.

Organizer: Messe Muenchen Shanghai Co., Ltd. TechSugar

International Flexible & Printed Electronics Forum

International Flexible & Printed Electronics Forum will kick off on July 3, 2020 at the National Exhibition and Convention Center（Shanghai）.
Making sensors by printing or based on flexible substrates are the new paradigms of electronic manufacturing. Flexible, printable and wearable electronics, so far rather uncommon terms in the electronics community, are becoming highly interesting topics.

Organizer: Messe Muenchen Shanghai Co., Ltd.

China International SiP Forum

China International SiP Forum will kick off on July 4, 2020 at the National Exhibition and Convention Center（Shanghai）.

Organizer: Messe Muenchen Shanghai Co., Ltd. Moore Elite

China Electronics Manufacturing Automation Innovation Forum

China Electronics Manufacturing Automation Innovation Forum will kick off on July 4, 2020 at the National Exhibition and Convention Center（Shanghai）.
China's electronics manufacturing industry is in the process of transition from semi-automation to automation, and it is urgent to improve the level of information technology and intelligence, and accelerate the pace of intelligent manufacturing, becoming an urgent task for China's electronics manufacturing industry. Whether manufacturing in China is going global, whether electronic manufacturing companies can successfully complete industrial upgrading and independent innovation is the core competitiveness that can truly survive at the top of the world industry in the future!

Theme: Electronics manufacturing 4.0, the Smart Factory

International Dispensing & Adhesive Technology Innovation Forum

International Connector Innovation Forum will be held on July 4, 2020 at the National Exhibition and Convention Center（Shanghai）. The conference will discuss Adhesive and dispensing technology trends and the current status in the electronics industry; New adhesive and dispensing technology development; Case study and the challenge of adhesive and dispensing technology in automotive electronics, portable equipment (smart phone, tablet, wearable devices and etc.) and communication industry; Adhesive and dispensing empower advanced-packaging; Adhesive technology: underhill, conformal coating, encapsulation, thermal conductivity, electrical conductivity, potting, dispensing and plasma surface treatment (plasma, corona) and etc.

Organizer: Messe München Shanghai Co., Ltd.

International Wire Harness Advanced Manufacturing Innovation Forum

International Wire Harness Advanced Manufacturing Innovation Forum will kick off on July 4, 2020 at the National Exhibition and Convention Center（Shanghai）.
Discuss on the hot topics like wire harness production revolution led by Industry 4.0, the trend of customized cable processing solution, the opportunities and challenges of wiring harness industry from new energy vehicles, and so on.

Organizer: Messe Muenchen Shanghai Co., Ltd.

EM Asia Award

Organizer: EM Asia Messe Muenchen Shanghai Co., Ltd.

Electronics Manufacturing Technology Application Contest

Collaborate with professional organizations, manufacturers and experts home and abroad to build a platform devoted to the improvement, upgrade, innovation and sharing of the electronics industry.

Organizer: EM Asia, Messe Muenchen Shanghai Co., Ltd.