Supporting program
Our forums, conferences, presentations of application examples and panel discussions will give you additional momentum and background information on the fair's interesting topics like electronic manufacturing, SMT, automation, wire harness manufacturing, printed electronics and adhesive move the electronics manufacturing industry. At productronica China, you will find answers to your questions on these and other topics.
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International Dispensing & Adhesive Technology Innovation Forum
International Connector Innovation Forum will be held on July 3, 2020 at the National Exhibition and Convention Center（Shanghai）. The conference will discuss Adhesive and dispensing technology trends and the current status in the electronics industry; New adhesive and dispensing technology development; Case study and the challenge of adhesive and dispensing technology in automotive electronics, portable equipment (smart phone, tablet, wearable devices and etc.) and communication industry; Adhesive and dispensing empower advanced-packaging; Adhesive technology: underhill, conformal coating, encapsulation, thermal conductivity, electrical conductivity, potting, dispensing and plasma surface treatment (plasma, corona) and etc.
Organizer: Messe München Shanghai Co., Ltd.
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International Wire Harness Advanced Manufacturing Innovation Forum
International Wire Harness Advanced Manufacturing Innovation Forum will kick off on July 3, 2020 at the National Exhibition and Convention Center（Shanghai）.
Discuss on the hot topics like wire harness production revolution led by Industry 4.0, the trend of customized cable processing solution, the opportunities and challenges of wiring harness industry from new energy vehicles, and so on.Organizer: Messe Muenchen Shanghai Co., Ltd.
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Intelligent Logistics System Solutions Seminar
Organizer: Messe Muenchen Shanghai Co., Ltd
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