International Dispensing & Adhesive Technology Innovation Forum

Room M1 (1st floor),Hall W1,SNIEC

General Information

Date:March 19, 2020

Venue:Room M1 (1st floor),Hall W1,SNIEC

Organizer: Messe Muenchen Shanghai Co., Ltd.

Language: Chinese or English, no simultaneous interpretation(Non-Chinese speakers are recommended to use bilingual slides)


Topics

Adhesive and dispensing technology trends and the current status in the electronics industry

New Adhesive and dispensing technology development

The development, application case study and the challenge of adhesive and dispensing technology in automotive electronics, Portable equipment (smart phone, tablet, wearable devices and etc.) and communication industry,

Adhesive technology: underhill, conformal coating, encapsulation, thermal conductivity, electrical conductivity, potting , dispensing and plasma surface treatment (plasma, corona and etc.) and etc.


2018 Audience Analysis


2018 Audience Sample List

Fiberhome Telecommunication Technologies Co., Ltd.

BOSCH

Yanfeng Automotive Interiors

Shanghai Huawei Technology Co., Ltd.

Shanghai Phicomm Technology Co., Ltd.

Ningbo CRRC Times Transducer Technology Co., Ltd.

Melit Technology Co., Ltd.

AAC Technologies Holdings Inc

Guangdong Fenghua Advanced Technology Holding CO., LTD.

WUHAN CHUWEII BIO-TECH CO., LTD.

Samsung semiconductor

Eolane Technology Co., Ltd.

Shanghai Aeronautical Ratio Electronics Research Institute

The 52nd Research Institute of CETG Corp

The 54th Research Institute of CETG Corp

Shangdong Hangtian Zhenghe Electronic

Zhejiang Uniview Technologies Co., Ltd.

General Electric

Scanfil (Hangzhou) Co., Ltd.

慕尼黑展览(上海)有限公司

上海市浦东新区源深路1088号平安财富大厦11楼

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