International Dispensing & Adhesive Technology Innovation Forum

Room M1 (1st floor),Hall W1,SNIEC

General Information

Date:March 21, 2019

Venue:Room M1 (1st floor),Hall W1,SNIEC

Organizer: Messe Muenchen Shanghai Co., Ltd.

Language: Chinese or English, no simultaneous interpretation(Non-Chinese speakers are recommended to use bilingual slides)


Topics

Adhesive and dispensing technology trends and the current status in the electronics industry

New Adhesive and dispensing technology development

The development, application case study and the challenge of adhesive and dispensing technology in automotive electronics, Portable equipment (smart phone, tablet, wearable devices and etc.) and communication industry,

Adhesive technology: underhill, conformal coating, encapsulation, thermal conductivity, electrical conductivity, potting , dispensing and plasma surface treatment (plasma, corona and etc.) and etc.


2018 Audience Analysis


2018 Audience Sample List

Fiberhome Telecommunication Technologies Co., Ltd.

BOSCH

Yanfeng Automotive Interiors

Shanghai Huawei Technology Co., Ltd.

Shanghai Phicomm Technology Co., Ltd.

Ningbo CRRC Times Transducer Technology Co., Ltd.

Melit Technology Co., Ltd.

AAC Technologies Holdings Inc

Guangdong Fenghua Advanced Technology Holding CO., LTD.

WUHAN CHUWEII BIO-TECH CO., LTD.

Samsung semiconductor

Eolane Technology Co., Ltd.

Shanghai Aeronautical Ratio Electronics Research Institute

The 52nd Research Institute of CETG Corp

The 54th Research Institute of CETG Corp

Shangdong Hangtian Zhenghe Electronic

Zhejiang Uniview Technologies Co., Ltd.

General Electric

Scanfil (Hangzhou) Co., Ltd.

  • Dispensing & Adhesive Technology

    Host: Dr. Kankai Ma Infinite Flex GmbH/Sixonia Tech CEO/VP
Time Topic Guest
Time TopicInteractive Communication Guest

Time TopicOverview of Adhesive Applications in Electronics Guest

Dr. Kankai Ma
Infinite Flex GmbH/Sixonia Tech CEO/VP

Time TopicHow a Materials Powerhouse Uses Trends to Enable Innovation and Sustainability Guest

Rogier Reinders
DOW Chemical Global Marketing Director, PCB & Systems Assembly, Consumer Solutions

Time TopicHow to Improve the Dispensing Efficiency in Intelligent Manufacturing Guest

Yemy Zhang
AXXON Product Manager

Time TopicInnovative Application and Development of Dispensing Solution in New Energy Vehicle Guest

Edwin You
Scheugenpflug Resin Metering Technologies (SIP) Co., Ltd Director

  • Dispensing & Adhesive Technology

    Host: Dr. Jianyi Shao Hoenle UV Technology (Shanghai) Trading Co., Ltd. Managing Director
Time Topic Guest
Time TopicSeveral Key Unsolved Adhesive Problems in Mini - loudspeaker Industry Guest

Dr. Jianyi Shao
Hoenle UV Technology (Shanghai) Trading Co., Ltd. Managing Director

Time TopicCombination of Theory and Practice in the Development And Application of Epoxy Potting Products Guest

Danny Ji
Techstorm Advanced Material Co., Ltd R&D Director

Time TopicSilicone Adhesive: Fast Cure and Adhesion Guest

Yi Zhao
Zhejiang Link Tech Silicone Material Ltd VP of Technology

Time TopicPending Guest

Eric Gu
Nordson ASYMTEK Application Manager

Time TopicPanel Discussion: Challenges and Opportunities of 5G to Dispensing and Materials Companies Guest

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