Date：March 19, 2020
Venue：Room M1 (1st floor),Hall W1,SNIEC
Organizer: Messe Muenchen Shanghai Co., Ltd.
Language: Chinese or English, no simultaneous interpretation(Non-Chinese speakers are recommended to use bilingual slides)
Adhesive and dispensing technology trends and the current status in the electronics industry
New Adhesive and dispensing technology development
The development, application case study and the challenge of adhesive and dispensing technology in automotive electronics, Portable equipment (smart phone, tablet, wearable devices and etc.) and communication industry,
Adhesive technology: underhill, conformal coating, encapsulation, thermal conductivity, electrical conductivity, potting , dispensing and plasma surface treatment (plasma, corona and etc.) and etc.
2018 Audience Analysis
2018 Audience Sample List
Fiberhome Telecommunication Technologies Co., Ltd.
Yanfeng Automotive Interiors
Shanghai Huawei Technology Co., Ltd.
Shanghai Phicomm Technology Co., Ltd.
Ningbo CRRC Times Transducer Technology Co., Ltd.
Melit Technology Co., Ltd.
AAC Technologies Holdings Inc
Guangdong Fenghua Advanced Technology Holding CO., LTD.
WUHAN CHUWEII BIO-TECH CO., LTD.
Eolane Technology Co., Ltd.
Shanghai Aeronautical Ratio Electronics Research Institute
The 52nd Research Institute of CETG Corp
The 54th Research Institute of CETG Corp
Shangdong Hangtian Zhenghe Electronic
Zhejiang Uniview Technologies Co., Ltd.
Scanfil (Hangzhou) Co., Ltd.