The new wire bond solution developed by Stratus Vision from Germany uses AI to identify the wire bonds. It is unique as it does not require bounding boxes for the setup of the inspection and is able not only to inspect the wires, but also the ceramic, copper, dies, SMT components and other components on the board.

Especially for customers with stitched wires or multiple moving components on a board we are able to provide a high reliability solution with over 90% real defect detection rates.

At the same time our solution often outperforms the competition in throughput and accuracy. 

We are happy to tell you more at our booth.