2025–2030 marks a "Golden Era" for the global Silicon Carbide (SiC) power device market. No longer solely reliant on electric vehicles, growth is now fueled by a diversified landscape including data centers, industrial automation, and energy sectors. The packaging technology of embedding SiC power devices directly into printed circuit boards (PCBs) represents a forward-looking exploration in the current field of power electronics. The discussion will delve into dimensions including the demand for performance breakthroughs, the evolution of packaging technologies, advancements in materials science, and trends in system integration.
| Time | Topic | Guest |
|---|---|---|
| 09:30-10:00 | Morning Registration | |
| 10:00-10:05 | Opening Remarks by the Moderator | Dr. Tingyu Lin |
| 10:05-10:20 | Plan for the School of Integrated Circuits, Shenzhen Polytechnic University | Dean YU Hongyu, Speech and Introduction of the School of Integrated Circuits, Shenzhen Polytechnic University |
| 10:20-10:40 | Power Semiconductor and Its Technological Progress | LIU Guoyou, Zhuzhou CRRC Times Semiconductor Co., Ltd., CRRC Scientist |
| 10:40-11:00 | Advanced Packaging Structures in SiC Power Modules | ZHANG Hao, Module R&D Center, BASiC Semiconductor Co., Ltd., Senior Chief Engineer |
| 11:00-11:20 | Improving Energy Utilization via Advanced Packaging | Zhengtianye (Daniel) Wang, Prismark Partners, Consultant |
| 11:20-11:40 | Relevance of Chiplets for European Electronics Equipment Makers | Dr. Sandra Engle, VDMA, Head of Sector Group Productronics |
| 11:40-12:00 | Enhancing Packaging Reliability: Using ALPHA Solder Paste Adhesive as an Integrated Solution in Advanced Packaging | Kiko CHEN, Macdermid Alpha, Business Development Manager |
| 14:00-14:20 | Application Solutions of High Thermal Conductivity Materials for Power Applications | LIU Qianfa, Shengyi Technology Co.，LTD., Director of the National Electronic Circuit Substrate Engineering Technology Research Center |
| 14:20-14:40 | 3D power package for AI application | Steve JIN, OIP Technology, CEO |
| 14:40-15:00 | High-precision, high-speed, and high-reliability pick & place equipment propel the industrialization of advanced packaging | HE Fengguang, Hefei Sineva Intelligent Machine Co.,Ltd, VCTO |
| 15:00-15:20 | Packaging Goes Heterogeneous — Proof 2 | M. Juergen Wolf, An Independent Consultant and Expert in Microelectronic Packaging Technologies |
| 15:20-15:40 | Ultrasonic Inspection Solutions for Embedded SiC Power Device in PCBs | YE Lezhi, Institute of Advanced Semiconductor Equipment, Beijing University of Technology-Director; China Electronic Special Equipment Industry Association-Deputy Secretary-General |
| 15:40-16:00 | Conquering the "Zero" Void: Vacuum Furnace Satisfies the Limit Process Requirements of Buried Resistance and Capacitance PCB | LIU Guanghui, Shenzhen Therlicon Technology Co., Ltd., R&D Director |
| 16:00-16:20 | Application and Support of PCB Embedded Technology to Power Module of New Energy Vehicle | Chen Jianyun, Shenzhen Kana Technology Co., LTD., Senior Manager of PLP Solutions |
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