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2025年3月26-28日
上海新国际博览中心
2025慕尼黑上海电子生产设备展 (productronica China)
展商中心

TGV Advanced Materials and Packaging Industrialization Opportunities Summit Forum

Time: March 20, 2024 09:00-17:30
Venue: SNIEC | Hall E6, 2nd Floor-M37
Organiser: Messe Muenchen Shanghai Co., Ltd.
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2024 展会回顾
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Introduction to the Forum

With the increasing complexity of semiconductor circuits, plastic substrates are nearing their capacity limit, particularly with the challenge of rough surfaces negatively impacting the inherent performance of ultra-fine circuits. Consequently, the semiconductor industry seeks a novel substrate solution. Intel anticipates that by the end of the 2020s (2020-2030), the semiconductor manufacturing process may confront constraints in reducing transistor sizes on organic material substrates, introducing mechanical issues such as power consumption, substrate shrinkage, and warping. Therefore, the shift towards glass panels emerges as a crucial factor in the forthcoming semiconductor manufacturing landscape. Intel envisions the launch of a comprehensive glass substrate solution in the latter half of the 2020s, poised to sustain Moore's Law beyond 2030.

This forum will delve into the practical applications of glass-based chip board across various domains, including Mini/Micro direct display, MIP packaging, 2.5D/3D packaging, radio frequency chip carrier boards, optical communication chip carrier boards, and other chip carrier boards, particularly advanced semiconductor packaging.

Topics:
  • Opportunities and challenges for TGV technology under the Al+Chiplet trend
  • Solutions of glass material manufacturers in glass substrate applications
  • Development of advanced packaging technology and its material requirements
Guest speaker To learn more about the speakers click

Agenda

TGV Advanced Materials and Packaging Industrialization Opportunities Summit Forum
为何参展
为何参展
预登记
立即购票
备用按钮
2024 展会回顾
Time Topic Guest
10:00 - 10:30 ilinki —Industrial Service Platform for Manufacturing Industry Haoran Zhen Zhihuiwanlian(Beijing)Info.Technology Co.,Ltd Marketing Director
10:30 - 11:00 Discuss The Reliability Of Low-Voltage Power System Gang Song Wago Electronic(Tianjin)Co., Ltd. Interface Product Manager 11:00 - 11:30 Flexible Conveying-Production Line Efficiency Multiplier Huazhen Song
11:30 - 12:00 SINSEGYE Intelligent Machine Family: Empowering Laser Intelligent Manufacturing Xiuchao Li SINSEGYE (Shenzhen) Computer Systems Co., Ltd. Product Director of IPC Product Line
13:30 - 14:00 Empower Intelligent Manufacturing With AI Bo Chen Shanghai Branch, Hikrobot Industry Director
14:00 - 14:30 “AI + Sensor” Opens a New Era of Intelligent Equipment Manufacturing Lingwen Yu Shanghai Pepperl+Fuchs Automation Trading Co., Ltd. Industry Technical Manager
可选的表格脚注文本...

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