2025 Electronics Intelligent Manufacturing and Cutting-Edge Technology Summit
2025.03.26
| SNIEC | Meeting Room E4-M27
Guest
Nie.fugang , ZTE- Chief Engineer
Nie.fugang
ZTE- Chief Engineer
Nie Fugang, Chief Engineer of Assembly Process Technology at ZTE Corporation, is a leading expert in this field. He's responsible for formulating the evolution roadmap of electronic assembly technology, building the specification system platform, and leading the medium- and long-term planning of assembly technology. He serves as a member of the technical expert groups of CPCA and CSTM, the Asia-Pacific technical expert group of SMTA, the chief expert of Guangdong SMT Special Committee, and an expert of Sichuan SMT Special Committee. He participates in several IPC standard professional groups as a technical committee member and has published many papers in the industry.
Time & Topic
Wednesday, March 26, 2025 10:00 AM - 10:30 AM
Challenges of solder joint reliability in new scenarios
Failure mechanism of solder joints under thermal cycling
Application technology of high-reliability solder paste
Guest
Kahn Huang , Nordson Electronics Solutions-Application Manager
Kahn Huang
Nordson Electronics Solutions-Application Manager
Kahn Huang is the application manager of Nordson Electronics Solutions,who is responsible for all the application support for dispensing, coating, plasma treatment and selective soldering. He has worked at Nordson for 13 years, and has recently focused on following up technical services for applications such as Sip, semiconductor advanced packaging and consumer electronics.
Time & Topic
Wednesday, March 26, 2025 10:30 AM - 11:00 AM
With the development of technology, there are more and more SｉP packages. Its biggest advantage is that it integrates multiple components into a single package, making the product thinner and smaller, and has high reliability. Therefore, SIP's plasma and precision dispensing have new difficulties and requirements, and our solutions specially developed for SIP perfectly solve these problems... Finally, we will bring you our revolutionary and subversive selective welding solution, welding while walking, increasing the output by 20-40%, and covering an area of 60%.
Guest
William Yu , MacDermid Alpha-Business Development Manager
William Yu
MacDermid Alpha-Business Development Manager
Time & Topic
Wednesday, March 26, 2025 11:00 AM - 11:30 AM
Guest
He Ya Jun , NIHON SUPERIOR (SHANGHAI) CO., LTD-Sales Supervisor
He Ya Jun
NIHON SUPERIOR (SHANGHAI) CO., LTD-Sales Supervisor
Time & Topic
Wednesday, March 26, 2025 11:30 AM - 12:00 PM
Guest
Ashley Zhao , Hangzhou Hikvision Digital Technology Co., Ltd.-Sr. Vertical Director
Ashley Zhao
Hangzhou Hikvision Digital Technology Co., Ltd.-Sr. Vertical Director
As the industry leader of industrial and commercial enterprises, Ashley Zhao has been deeply involved in the industrial industry for many years, understanding factory applications and manufacturing needs. He has extensive practical experience in visual result detection and video process tracing, and has a deep understanding of the application of AI technology in the manufacturing industry.
Time & Topic
Wednesday, March 26, 2025 1:30 PM - 2:10 PM
Guest
Haley Fu , INEMI (International Electronics Manufacturing Initiative)-Director of Asia Operations
Haley Fu
INEMI (International Electronics Manufacturing Initiative)-Director of Asia Operations
Dr. Haley Fu graduated from Shanghai Jiao Tong University in 2000 with a Ph.D. in Mechanical Engineering. From 1998 to 1999, she conducted research on environmental design projects at the Technical University of Berlin. Before joining INEMI in 2007, she worked for Motorola, UT Starcom, and Schneider Electric, with multiple roles in the R&D and supply chain management. She is now responsible for INEMI technical activities, global collaboration project management, and operations in Asia Pacific. She is managing the INEMI projects on low-temperature solder technology and reliability, warpage characteristics and simulation of advanced packaging devices, development of rapid performance evaluation for confomal coatings, enhancement of AOI capabilities via AI, and reliability of automotive electronics.
Time & Topic
Wednesday, March 26, 2025 2:10 PM - 2:40 PM
Automated optical inspection (AOI) systems are essential in electronic manufacturing for ensuring the quality of printed circuit board assemblies (PCBA). Traditional AOI systems, however, face significant challenges due to high false call rates and defect escapes, particularly as electronic designs become more complex. The integration of artificial intelligence (AI) has emerged as a promising solution to enhance the capabilities of AOI systems. INEMI launched a project in 2021 to Investigate the AI Enhancement to AOI for PCBA. The project team surveyed the current state of AI and AOI technologies in the industry, established common performance metrics, and prepared test vehicles for subsequent experiments. This presentation will introduce the learnings from the survey and the experimental work and provide an overall picture of the application status, challenges, and the opportunities of AI for AOI in PCBA.
Guest
Yu Chien Pang , Chief Engineer/Deputy General Manager Cloud-TEK
Yu Chien Pang
Chief Engineer/Deputy General Manager Cloud-TEK
Time & Topic
Wednesday, March 26, 2025 2:40 PM - 3:20 PM
Guest
Dave Pang , VISCOM Machine vision -sales manager
Dave Pang
VISCOM Machine vision -sales manager
Responsible for the sales of Viscom devices in China, coordinating and managing sales channels, and assisting in marketing activities.
Time & Topic
Wednesday, March 26, 2025 3:20 PM - 3:50 PM
Overview of the principles of classification and detection matching in artificial intelligence
Specific introductions to programming, graphic classification, and secondary processing assistance
The Application of Artificial Intelligence in VISCOM Devices
Guest
Johnny Zhu , Presence (Shanghai) Technologies Co., Ltd-General Manager
Johnny Zhu
Presence (Shanghai) Technologies Co., Ltd-General Manager
1. Graduated from Hohai University in 1999, majoring in Mechanical and Electrical Engineering 2. 25+ years of precipitation in the application and research and development of electrical packaging technology and industrial software -3+ SMT process engineer in Taiwan enterprise, responsible for new product introduction and process optimization; - 5 + years senior foreign office software solutions consultants (Siemens/Tecnomatix/FABmaster/ripasa, Valor NPI/MES, etc.) -14+ years co-founder of a company, served as Product director/R&D director/global strategic cooperation Director, led the team to develop a number of NPI industrial software (DFM/Test/SMT, etc.) 3. Participated in several IPC international standard technology development -IPC/DAC-2552MBD Electronic device standard based on model definition -IPC-DPMX(IPC-2581) Digital Product model data exchange standard -IPC-9541 System Level Packaging (SiP) Acceptability standard -IPC-2591 CFX Connected Factory Data Exchange Standard 4. Has a number of joint invention patents 5. Founder of Presence Technology, the first true 3D mechatronics DFx verification scheme - Realized mechatronics cognate review based on process knowledge rule base, and has successfully landed in aerospace and other enterprises.
Time & Topic
Wednesday, March 26, 2025 3:50 PM - 4:20 PM
1. 3D intelligent modeling of integrated circuit packaging substrates
2. Parametric design of 3D package structure model
3. Electromechanical assembly of microsystem components
4. Automatic DFX review based on process rule base
5. DFX defect analysis and review report
6. Briefly share 3D Denso DFX solution
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