Glass Substrate Promote Chiplet Industry Development Summit Forum
2025.03.27
| SNIEC | Meeting Room E4-M27
Guest
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Yu Zongguang , The 58th Research Institute of China Electronics Technology Group Corporation -Chief Scientist of China Electronics Technology Group Corporation
Yu Zongguang
The 58th Research Institute of China Electronics Technology Group Corporation -Chief Scientist of China Electronics Technology Group Corporation
Dr. Yu Zongguang, born in September 1964 in Weifang, Shandong Province, is a second-level researcher and doctoral supervisor. He is the winner of the Commemorative Medal for the 70th Anniversary of the Founding of the People's Republic of China, an expert of the National Science and Technology Major Project of Core Electronics, High-end General Chips and Infrastructural Software, an expert enjoying special government allowance from the State Council, a national candidate of the One Hundred, One Thousand, and Ten Thousands of Talent Program, a Young/Middle-aged Expert With Outstanding Contributions in Jiangsu Province, and a Young and Middle-aged Chief Scientist in Jiangsu Province (a first-level expert of Jiangsu 333 Project). He has been engaged in integrated circuit design and R&D for 38 years. He has presided over more than 30 national, provincial and ministerial-level major projects, won 1 second prize of the National Science and Technology Progress Award, 4 first prizes and 11 second prizes of the Provincial Science and Technology Progress Award, published two monographs and more than 100 papers, and obtained more than 20 nationally authorized invention patents. He once served as the Chief Expert of China Electronics Technology Group Corporation, Deputy Director of the 58th Research Institute of China Electronics Technology Group Corporation and Deputy General Manager of China Key System & Integrated Circuit Co., Ltd. At present, he is the Chief Scientist of China Electronics Technology Group Corporation, Researcher and Doctoral Supervisor of the 58th Research Institute of China Electronics Technology Group Corporation, Rotating Chairman of the Packaging and Test Branch of China Semiconductor Industry Association, President of Wuxi Integrated Circuit Society, Fellow of Chinese Institute of Electronics, Editorial Board Member of academic journals such as Chinese Journal of Electronics, Semiconductor Technology and Integrated Circuits and Embedded Systems.
Time & Topic
Thursday, March 27, 2025 10:10 AM - 10:30 AM
The current situation and research hotspot of integrated circuit technology and industry, the development momentum and research progress of advanced packaging, the progress and application of chiplet technology.
Guest
Dr Xiaobo Huang , Xpeedic-Director of Technical Marketing
Dr Xiaobo Huang
Xpeedic-Director of Technical Marketing
In 2011, he obtained his Ph.D. degree in Electronic Engineering from the Chinese University of Hong Kong. His research areas include microwave and electromagnetic field technology, millimeter-wave LTCC array antennas, high-frequency dielectric filters, and semiconductor passive integrated devices (IPD). He has published several papers in IEEE Transactions, IEEE Letters and other journals, and possesses over 12 years of product and management experience in the ICT industry. Currently, he serves as the Director of Technical Marketing at Xpeedic, responsible for the promotion of EDA applications and ecosystem development, aiming to accelerate the realization of next-generation intelligent electronic systems and the independent advancement of the EDA industry.
Time & Topic
Thursday, March 27, 2025 10:30 AM - 10:50 AM
The application of glass substrates in fields such as HPC, AI, and 5G has become an industry consensus. Compared to traditional substrate materials, advanced packaging based on TGV offers faster signal transmission speeds, lower power consumption, and higher integration levels, significantly enhancing the performance, power efficiency, and compactness of chip-integrated systems. This presentation will focus on the current development status and trends of glass substrates, using advanced packaging cases of high-performance Chiplet integrated systems as examples. From an EDA perspective, it will explore the challenges faced in design and simulation analysis, aiming to jointly build an industrial ecosystem for advanced glass substrate packaging and accelerate the implementation of Chiplet integrated systems.
Guest
Zhengtianye (Daniel) Wang , Prismark Partners-Consultant
Zhengtianye (Daniel) Wang
Prismark Partners-Consultant
Dr. Zhengtianye Wang joined Prismark Partners LLC in 2022. He obtained his B.Sc. degree in Material Physics in 2017 from University of Science and Technology of China and his Ph.D. in Material Science and Engineering in 2022 from University of Delaware. He does business strategy and market analysis of semiconductor and packaging industry, especially focused on business opportunities and technology developement of advanced packaging. He also follows electronic system, semiconductor equipment, networking and AI infrastructure development.
Time & Topic
Thursday, March 27, 2025 10:50 AM - 11:20 AM
The semiconductor industry experienced a bifurcated market in 2024. Memory and AI processors at data centers grows quickly while regular server, communication infrastructure, 3C, industry and automotive market still suffer from significant inventory issue. The growing demand of AI infrastructure and personal AI electronics is going to drive significant value of advanced packaging in the coming years. In this presentation, advanced packaging in cloud server, PC, mobile phone and edge devices will be reviewed. AI impact on development trend of advanced packaging will also be discussed.
Guest
Lin Tingyu , Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.-Deputy General Manager/Chief Scientist
Lin Tingyu
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.-Deputy General Manager/Chief Scientist
Lin Tingyu, Deputy General Manager and Chief Scientist of Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. (Fozhixin) Having been engaged in the research of semiconductor microelectronic packaging and reliability for a long time, Lin Tingyu once presided over the formulation of strategic and planning technical solutions suitable for China's production and R&D foundation, established world-class TSV/PCBA/SMT process design standards, realized the connection of 2.5D/WLP/PLP overall process flow, filled the gap in domestic 2.5D/3D/PLP overall integration technology, and participated in leading a number of projects of manufacturing technology and complete sets of technology for very large scale integrated circuits (serving as the project leader and chief scientist), and won the China's National New Technology Award for Semiconductors in 2015/2017.
Time & Topic
Thursday, March 27, 2025 11:20 AM - 11:40 AM
In recent years, as electronics have become smaller, lighter and cheaper, the way chips are packaged has been constantly updated in the post-Moore's Law era. In the field of advanced packaging, fan-out panel-level packaging (FOPLP) and glass substrates have become hot spots in research and industrialization due to their respective advantageous performances and other strengths.
Fozhixin has been engaged in the R&D and production of FOPLP and glass chip packaging substrates for a long time. It has mastered many semiconductor fan-out packaging core processes such as glass micropore processing and metallization technology, panel-level high aspect ratio copper pillar process, panel-level warpage control and chip offset correction. In terms of glass surface metallization, it has realized the manufacturing of chip boards with low temperature, low roughness and high binding force (the binding force between copper and glass is more than 15 N/cm). In conclusion, Fozhixin’s technical capability has reached the international advanced level. This article will focus on the challenges faced by FOPLP and glass chip packaging substrate technologies, as well as product applications."
Guest
Wei Bingyi , TGV (Hubei) Circuits Technology Co., Ltd. of WG Tech-Semiconductor SBU General Manager
Wei Bingyi
TGV (Hubei) Circuits Technology Co., Ltd. of WG Tech-Semiconductor SBU General Manager
Graduated from Huazhong University of Science and Technology, once worked for a leading communication equipment company in China. He has many years of working experience in optoelectronics, wireless communications and advanced semiconductor packaging fields, and is an industry expert.
Time & Topic
Thursday, March 27, 2025 2:00 PM - 2:20 PM
With the changes in international geopolitical pattern, international trade uncertainty continues to increase. At the same time, the huge terminal application market, such as the surge in demand for advanced computing power, continues to drive the development of semiconductor advanced packaging industry. Domestic substitution and independent research and development have become unprecedentedly important. Overall, opportunities and challenges coexist in the semiconductor industry.
In the post-Moore era, the focus of semiconductor industry has gradually shifted to the innovation of packaging technology. As an important link in the core semiconductor industry chain, advanced packaging has become a key way to improve chip performance and an important path to extend Moore's Law. With the rise of AI and 5.5/6G applications, the demand for semiconductor devices has dramatically increased, leading to a broader application of advanced packaging technology.
In the field of advanced semiconductor packaging, WG Tech innovatively proposed to replace silicon substrate with glass substrate for advanced semiconductor packaging. After years of unremitting research and development, WG has built an end-to-end solution for the whole industry chain, and is in an industry-leading position in terms of technological reserves and forward-looking layout of production capacity. In the production of TGV metal lines, the combination of glass and copper is challenging. The PVD copper plating technology independently developed by WG has made key breakthroughs in copper thickness, adhesion and yield. At the same time, it is expected that the upstream and downstream of the industrial chain will work together to overcome more difficulties.
Guest
Steve Jin , OIP Technology Singapore-CEO
Steve Jin
OIP Technology Singapore-CEO
25 years experience in advanced packaging, 8 years expericne in Apple and 7 years experience in STM, lead advanced packaging team for FOPLP.
Time & Topic
Thursday, March 27, 2025 2:20 PM - 2:40 PM
3rd generation of FOPLP which integated electronics and optical
Guest
Jin Liangmao , China National Building Materials Glass New Materials Research Institute Group Co., Ltd-Professor of Engineering
Jin Liangmao
China National Building Materials Glass New Materials Research Institute Group Co., Ltd-Professor of Engineering
As a member of the National Excellent Engineer Team, Jin Liangmao has long been engaged in R&D and industrialization of photoelectric display glass, pan-semiconductor glass, functional film glass and new energy glass. He has presided over and participated in more than 10 major projects such as the National Key Research and Development Program, the National Basic Research Program (973 Program), and Anhui Science and Technology Major Project. He has won 2 China Patent Awards, 1 First Prize of Technological Invention Award of the industry, 2 Anhui Provincial Patent Gold Awards and 2 Second Prizes of Anhui Provincial Science and Technology Awards; he has been granted 6 PCT international patents and 15 Chinese invention patents, formulated and revised 5 national/industrial standards, and published more than 10 academic papers.
Time & Topic
Thursday, March 27, 2025 2:40 PM - 3:00 PM
TGV technology is an emerging vertical interconnection technology aimed at the advanced packaging field of semiconductors. It will redefine chip packaging and promote advancements in Moore's Law. Glass substrates have excellent mechanical properties, outstanding dielectric performance, and adjustable coefficients of thermal expansion, achieving optimal compatibility with semiconductor processes. They are one of the inevitable trends in semiconductor development in the post-Moore era. Substrate glass is a key core material for TGV technology. Advanced packaging processes impose special requirements on its coefficient of thermal expansion, glass transition temperature, dielectric loss, Young's modulus, and warpage. It is necessary to strengthen the design of glass material systems, innovate processing technologies, and enhance collaboration across the industrial chain to contribute to the evolution of TGV advanced packaging technology.
Guest
Ni Zikai , Maike Semiconductor Technology (Guangzhou) Co., Ltd.-Deputy General Manager
Ni Zikai
Maike Semiconductor Technology (Guangzhou) Co., Ltd.-Deputy General Manager
Maike Semiconductor Technology (Guangzhou) Co., Ltd. (Maike Semiconductor) has been deeply engaged in the key laser process of semiconductor glass substrates for many years, and has rich experience in domestic alternative equipment.
Time & Topic
Thursday, March 27, 2025 3:00 PM - 3:20 PM
1. Laser induced drilling (laser-induced + etching + AOI)
2. Laser cutting
3. Laser repair
Guest
Hu Wei , Wuhan Jingce Electronic Group Co., Ltd.-Marketing Director
Hu Wei
Wuhan Jingce Electronic Group Co., Ltd.-Marketing Director
Hu Wei, Marketing Director of Wuhan Jingce Electronic Group Co., Ltd. (Jingce Electronic), is committed to the market expansion and strategic development of emerging industries. In the fields of micro display silicon-based OLED/Micro LED, ARVR and semiconductors, Mr. Hu has led his team to successfully tap into multiple markets, achieving sales revenue and growth, and establishing an extensive partner network.
Time & Topic
Thursday, March 27, 2025 3:20 PM - 3:40 PM
Jingce Electronic's product layout and solutions cover the full processes of semiconductor measurement and testing, including the front-end process, advanced packaging, and back-end process.
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