Press Release

Focusing on Key Technological Breakthroughs to Foster Efficient, Green, and Intelligent Manufacturing in the Adhesive and Dispensing Industries

December 19, 2024

The productronica China, a crucial platform for showcasing and exchanging ideas in the electronic intelligent manufacturing industry, will grandly resume from March 26 to 28, 2025, in Halls E1-E5 & W1-W3 of the Shanghai New International Expo Centre (SNIEC). This exhibition will be extensive, covering nearly 100,000 square meters. It is expected to attract nearly 1,000 quality enterprises from the electronics manufacturing industry. They will showcase products and technologies spanning the entire electronic manufacturing supply chain, including electronic and chemical materials, dispensing and gluing technologies, electronic assembly automation, testing, measurement, and quality assurance, electronic manufacturing services, surface mount technology (SMT), harness processing and connector manufacturing, component and part manufacturing, motion control and drive technology, industrial sensors, robotics, and intelligent warehousing, among others.

Adhesives guarantee product stability and are crucial in production and manufacturing

In the electronics manufacturing industry, selecting suitable adhesives requires a comprehensive evaluation of multiple indicators such as operation convenience, curing conditions, bonding strength, heat resistance, chemical corrosion resistance, and durability. This thorough consideration ensures optimal use effect. Moreover, the rapid growth of industries such as intelligent terminals, new energy vehicles, photovoltaic, semiconductors, and communications creates a stable market demand for adhesives and serves as new growth drivers. This requires continuous innovation of adhesive products to meet the requirements of new technologies and processes while also facilitating the continuous optimization and upgrading of the products. Considering the vast potential of the adhesive market, numerous well-known domestic and international enterprises have increased their investments in this sector, launching a range of high-quality adhesive products.

For popular applications in the electric vehicle (EV) sector, Dow's DOWSIL™ TC-2035 CV Adhesives, DOWSIL™ TC-4551 CV Gap Fillers, and DOWSIL™ TC-4060 GB250 Thermal Gels offer controlled volatility, high reliability, high thermal conductivity, and superior heat dissipation efficiency. These products also feature easy processing and optimized production efficiency to support automotive electronics amidst the electrification trend. DOWSIL™ TC-2035 CV Adhesives, featuring high thermal conductivity and excellent fast-curing properties at room temperature, are ideally suited for assembling automotive electronics, including precision electronic components such as advanced driver assistance systems and electronic control units. The excellent thermal conductivity of DOWSIL™ TC-4551 CV Gap Fillers not only ensures the stable operation of highly sensitive automotive electronic modules but also offers a reliable solution for automobile power modules such as engines or transmission control units. These two new products also feature controlled volatility, which can effectively prevent electric contact failure caused by the volatilization of volatile substances.

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BERGQUIST GAP FILLER TGF 4400LVO is Henkel's latest generation of thermal gap filler range tailored specifically for demanding automotive applications. This product is a 2-part, room-temperature curable gap filler based on low volatile silicone technology. The product boasts an extended working time of up to 90 minutes and cures at room temperature in 12 hours. With a thermal conductivity of 4.4 W/(m.K), it can be optimized to be dispensed with a thinner bond line, allowing for fast processing and high reliability. This makes it ideal for applications such as control units and ADAS components.

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With its outstanding product properties, H.B. Fuller not only provides protection for fine component assembly but also meets the functional requirements for thermal or electrical conductivity while ensuring chemical resistance and hypoallergenicity for applications that may come into contact with the human body. It provides precise, reliable, fast, and efficient bonding solutions for cameras, radars, and various induction devices in automobile driver assistance systems. Additionally, it provides adhesive solutions for vehicle electronic control units from chips to modules, such as packaging, underfilling, circuit board protection, heat conduction, and sealing. H.B. Fuller is committed to providing customers with cross-regional and diverse technical and product support by leveraging its global R&D and production strengths.

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To address the thermal management challenges of the latest Cell-to-Pack (CTP) battery designs in EV solutions, BOSTIK launches XPU TCA 202, a 2-part polyurethane-based thermal conductive adhesive, specifically designed for heat dissipation in battery pack assemblies. It offers an ideal balance of thermal conductivity and high mechanical strength while maintaining good flexibility due to its high elongation. Its low monomer content allows it to meet the most stringent regulatory requirements and enables easy product handling without specific training. In practical applications, this product enables easy and fast processing with automatic mixing, dosing, and dispensing equipment. This product has good adhesion on many substrates without the use of a primer and cures at room temperature.

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The WD3135D/3137D low-density adhesive produced by Kangda New Materials is a 2-part, solvent-free epoxy adhesive with advanced properties such as lower density, higher toughness, and enhanced strength after curing. It is ideal for bonding extra-large wind turbine blades, offshore wind turbine blades, and similar large composite structural components. To meet the diverse product needs of customers in blade manufacturing, Kangda New Materials has launched essential materials required for blade manufacturing, such as epoxy infusion resin, polyurethane infusion resin, and blade main beam plate composite materials. These materials have been successfully applied in batches in the wind power market.

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In the thermal management field, thermal interface materials (TIMs) are widely used in heat dissipation systems to cool and protect electronic chips. TIMs produced by Honeywell International Inc. feature excellent thermal conductivity, good long-term reliability, and high cost-effectiveness, ideal for tackling challenging heat dissipation issues. Moreover, the company is actively developing the next generation of vehicle TIMs to support the growth of new energy vehicles.

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Innovation in dispensing technology facilitates the intelligent transformation of electronic manufacturing

With the rapid development of the electronic manufacturing industry, dispensing technology, as a key manufacturing process, continues to experience innovation. The latest generation of dispensing equipment achieves greater precision and faster production speed by adopting advanced motion control technology and a sophisticated fluid control system. This innovation meets the dispensing requirements for micro components and complex structures in electronic product manufacturing. By integrating advanced technologies such as machine vision and AI algorithms, modern dispensing equipment can automatically identify and adapt to various workpiece shapes and sizes, enabling unmanned operation and significantly enhancing production efficiency and flexibility. Technological advancements in dispensing equipment have become a key factor in driving the upgrading of the electronic manufacturing industry. These innovations not only enhance production efficiency and product quality but also promote the whole electronic manufacturing industry to a higher level.

Axxon's precision dispensing system adopts cutting-edge screw technology, offering outstanding characteristics of low-pressure operation, pulse-free supply, and low shear strength. This design ingeniously addresses the issue of adhesive stratified precipitation and volatilization caused by a high-pressure environment, effectively preventing adhesive curing. Additionally, based on the pulse-free continuous supply of adhesives, this system eliminates the backfill phenomenon and significantly reduces the cycle time (CT). In addition, the self-sealing characteristic of the screw ensures stable and accurate adhesive dispensing, maintaining an error within ±5%. The system also integrates Axxon's unique switch valve design and is supplemented by an intelligent back-sucking function. This integration not only effectively prevents adhesive dripping but also significantly reduces the uneven ends on adhesive strips. The system can integrate advanced 3D linear scanning laser technology to accurately detect core parameters such as length, width, and height of adhesive strips, area coverage rate, position accuracy, and dispensing defects. This function can efficiently prevent defective products from entering the assembly process, thus saving additional equipment cost and space resources while enabling whole-process closed-loop monitoring of dispensing inspection.

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Leading the innovation in dispensing technology, Guangdong Anda Automation Solutions Co., Ltd. launches a new generation of three-stage vacuum dispensing machines specially tailored for precision products such as power modules and automotive electronics in the IGBT industry. This innovative equipment features cleverly designed front and rear vacuum cavities, which consistently maintain the dispensing cavity in an optimal negative pressure environment. This design significantly reduces the time for pressurization and depressurization and shortens the CT, thus greatly improving the dispensing efficiency and productivity. Moreover, it also meets the stringent requirements for high-precision dispensing in emerging fields such as 5G communication, new energy, and smart wear, offering unprecedented stability and reliability to precision manufacturing.

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With the growing demand for durable motors with high power density and low noise emissions in EVs, the dipping impregnation process for rotors and stators is crucial in motor manufacturing. ViscoTec has combined years of experience gained from trickling application projects with the advantages of progressive cavity technology to develop a new generation of vipro-PUMP MR series metering pumps. The vipro-PUMP MR series offers equipment operators a virtually maintenance-free, high-precision metering pump that can handle all conventional resin impregnations, even chemically aggressive resins. This provides manufacturers with the advantages of easy maintenance and exceptional durability.

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In the field of automobile manufacturing, details determine the quality of craftsmanship. To address the challenge that auto parts manufacturers face in precisely applying grease on radio and climate control switches, Nordson EFD's Liquidyn® P-Jet Series Jetting Valves, combined with the EV Series Automated Dispensing System, effectively reduce friction noise between plastic components. They also help prevent issues such as excessive grease dot volume and oozing, ensuring consistency and repeatability in the dispensing process. Nordson EFD's advanced non-contact jetting valve system offers exceptional performance and perfectly replaces traditional 30cc dispensing syringes, ensuring high accuracy and consistency in adhesive dispensing. By integrating PICO Pμlse and Toμch jetting technology, the system effectively reduces the dispensing time for customers from 2.23 seconds to 0.6-0.9 seconds.

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Mingseal Technology offers dispensing solutions for the automobile industry. Its sealing and dispensing station is an online dispensing machine designed for sealant processes such as housing sealing and end cover sealing involved in electric drive, electronic control, and traditional parts. This machine can be seamlessly integrated into entire production lines of integrators. The hardware of the whole machine includes the glue supply system, material preparation system, metering system, process module, and three-axis motion system. The software adopts the self-developed intelligent dispensing system featuring functions such as CCD guidance, CCD inspection module, laser altimetry, automatic needle alignment, automatic spot check & weighing, and MES communication.

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Musashi Engineering is a global leading dispensing equipment manufacturer, offering an extensive product line of dispensers designed to provide customers with optimal dispensing solutions for a wide range of liquid materials. Its dispensing process is widely used in various fields such as semiconductors, displays, mobile phones, communications, automobiles, and medical biology to achieve high-precision, high-quality, micro, quantitative, and high-speed dispensing. The new SuperΣCM4 dispenser launched by Musashi Engineering as the flagship model of the SuperΣ series pneumatic dispensers, offers traceability, energy efficiency, and compact design. It significantly saves space when integrated with automation equipment. In line with the development of "Industry 4.0", it is equipped with Ethernet ports to enable network management of "multiple controls for one machine" and "remote control". Musashi Engineering will continue to advance and innovate the performance and functions of dispensers, leading the industry trend in dispensing processes.

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In line with the high-precision development of the dispensing process, Shenzhen Tensun Precision Equipment Co., Ltd. has successively launched core valve bodies such as screw valves and piezoelectric injection valves, which are mainly used for Underfill, UV, Solder Paste, Silver Glue, and other processes. The minimum dot diameter can reach 200 μm, with a minimum dispensing volume of 0.5 nl.

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The conformal coating spraying system developed by H&H Technology is a flexible robotic operation platform, offering localized manufacturing and services. It provides excellent process operability and can automatically perform selective spraying on circuit boards with precision and high speed, ensuring uniform coating thickness. It can perform automatic programming through CAD graphic image input and also supports the automatic programming of any track manually entered via the handle. The system features a self-developed Chinese operation interface that is simple and easy to learn. It is stable and reliable, offering high precision and great cost-effectiveness.

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The online double acting dispensing equipment of GK-PRETECH is a high-precision dual-valve dispensing system developed based on the multi-axis network motion control software algorithm. It combines high efficiency, precision, and flexibility. While maintaining high dispensing accuracy, it can perform synchronous and asynchronous dispensing with dual valves, significantly enhancing dispensing efficiency. Additionally, the equipment features a flying photography scanning system that can perform the flying scanning and positioning function. This function saves the stabilization time of photographing after the scanning camera is positioned for each product in traditional scanning and positioning. As a result, it significantly enhances scanning and positioning efficiency while maintaining reliable positioning accuracy. This is particularly beneficial for high-precision dispensing operations on tiny components of array products.

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Plasmatreat's innovative online plasma redox processing system for power module assembly: REDOX-Tool based on its Openair-Plasma® atmospheric plasma technology is the key solution for addressing the challenges in power module assembly. The system is specifically designed to remove the oxide layer, reducing its impact on the performance or reliability of power modules. It can be used from the initial stages of DBC substrate preparation to die attach, wire bonding, and injection molding. The REDOX-Tool facilitates a seamless production process. It enhances the overall quality, performance, and lifetime of power modules by effectively reducing oxide-related process issues. It has the following process characteristics and advantages: online processing; zero-potential plasma processing of nondestructive electronic components; high productivity and cost-effectiveness; online processing for process repeatability and high productivity; whole-process monitoring of all critical parameters to ensure stable processes with accurate SPS data; no need for chemicals, flux, or citric acid in the treatment process; no flux residues; enhanced application conditions of underfillers; prevention of voids.

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These manufacturers will showcase their innovative products and application solutions at the productronica China 2025, scheduled to take place at the Shanghai New International Expo Centre (SNIEC) from March 26 to 28, 2025. Additionally, leading companies in the adhesive industry, such as Csun Technology, Sealant, Cemedine, LinkTech Silicone Material, Momentive Performance Materials, Guibao, Rampf, and Leekeen, as well as dispensing equipment and material companies, such as Hi Express Robot System, Mettler Toledo, Shenzhen XETAR Technology, and Visee, will showcase innovative technology concepts and share forecasts on industry development trends with visitors. We cordially invite you to register for the exhibition.

Secure premium booths! 2025 booths in high demand!Focusing on Key Technological Breakthroughs to Foster Efficient, Green, and Intelligent Manufacturing in the Adhesive and Dispensing Industries

We extend a heartfelt invitation to electronic manufacturing enterprises both domestically and internationally to participate in the exhibition. Here, you will have an unparalleled opportunity to showcase your latest products and technologies. Leveraging the exhibition's strong influence and wide reach, you can precisely reach target customers and swiftly expand your presence in both domestic and international markets. Moreover, a wide range of exchange activities will foster in-depth collaboration among enterprises. Together, we will explore industry trends, uncover potential business opportunities, achieve mutually beneficial outcomes, and collectively compose a remarkable chapter in the history of the electronics manufacturing industry. There are still a few booths available, so book quickly to seize the competitive advantage in the industry! For further information, please contact Ms. Sinsia at +86 21 20205553.

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