"Cloud-Edge-Device Collaboration & Liquid Cooling Revolution: Empowering Industrial Applications of Embodied AI" Forum

Time: Thursday, March 26, 2026 10:00 AM - 5:00 PM
Venue: Meeting Room W3-M10
Organiser: Messe Muenchen Shanghai Co., Ltd.
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Forum Introduction

Bringing together industry, academia, and research experts to explore innovations in computing power, algorithms, and thermal management, and to scale Embodied AI across industrial, service, healthcare, and energy sectors.

Key Topics
  • The "Nerve Center" of Embodied AI: Top-Level Design and Implementation of Cloud-Edge-Device Collaborative Architecture
  • Evolution of the "Brain": Challenges and Breakthroughs in Cloud Training and Edge Deployment of Large AI Models
  • Cooling the "Fever" of Computing Power: Liquid Cooling Solutions for High-Density Computing Bottlenecks
  • Bridging Cloud and Edge: Delivering Deterministic Connectivity for Embodied AI via 5G+MEC Networks
  • The Roadmap and Future of Embodied AI: From Research Labs to "Lighthouse Factories" “Sub-Zero” Computing: Liquid-Cooled Edge Servers Empowering Industrial Robot Clusters
  • Pushing the Limits of "Joints": Thermal Management Innovations for High-Power-Density Humanoid Actuators
  • From Thermal Management to “Cold” Power: How Liquid-Cooled Joint Modules Unlock Reliable Performance for Embodied AI

Meeting Agenda

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预登记
立即购票
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2024 展会回顾
Time Topic Guest
9:00-9:55 Morning session registration
9:55-10:00 Opening remarks by the moderator
10:00-10:30 The "Nerve Center" of Embodied AI: Top-Level Design and Implementation of Cloud-Edge-Device Collaborative Architectures Zhang Changhai, Baidu Cloud, Director of Manufacturing Industry Solutions
10:30-11:00 Exploring AI-Powered Digital and Intelligent Upgrading Applications in the Manufacturing Industry Li Haipeng, iFLYTEK National Intelligent Voice Innovation Center, Deputy Director of Public Affairs
11:00-11:30 Challenges and Development Approaches for Embodied Robotic Brain Technology: Mscape Silicon-Based Brain Solution Xu Haijiang, Shanghai Mscape Technology Co., Ltd., Co-founder and Vice President
11:30-12:00 How 5G + MEC Networks Enable Deterministic Connectivity for Embodied AI Li Bing, NOVA Technology Company Limited, Technical Director
13:30-14:00 Embodied AI Inspection Practices: Data and Computing Power Driving Efficient Operations in All-Scenario, All-Terrain Robotic Maintenance Zhao Liang, DiManShen (Shanghai) Technology Co., Ltd. iRIC Intelligent Manufacturing and Robotics International Joint Innovation Center, Technical Director
14:00-14:30 "Freezing Point" Computing Power: Enabling Industrial Robot Clusters through Liquid-Cooled Edge Servers Han Xuebing, Dawning Information Industry Co., Ltd., Senior Solution Engineer
14:30-15:00 Limits of "Joints": Innovations in Thermal Management for High Power Density Robotic Actuators Liu Peng, Tyco Electronics, Key Account Manager
15:00-15:30 Empowering Industrial Intelligent Agents through Cloud-Edge-Device Collaboration: Practice of Rockwell PLEX & FT Digital Factory Solutions Wang Zhenhua, Rockwell Automation (China) Company Limited, Software Manager
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