Driven by the explosive growth in NEVs and AI computing, Power Semiconductors are deeply integrating with Electric Drive systems. As power demand for AI servers and data centers surges, the global data center power market is projected to reach $15 billion by 2026. Notably, Wide Bandgap (SiC/GaN) adoption is expected to jump from 12% in 2023 to 40%.
Yet, the industry still faces critical challenges in device reliability, packaging integration, and cost control. Sharing key technological synergies in Wide Bandgap (WBG) applications, thermal management, and efficient conversion, the 2026 Power Semiconductor & E-Drive System Collaborative Development Technology Forum is launched. It serves as a cross-sector platform bridging Automotive and Power Electronics to unify the 'Chip-Module-E-Drive-Vehicle' chain, fostering industry-academia-research collaboration and advancing industrial integration.
| Time | Topic | Guest |
|---|---|---|
| 10:00-10:10 | Speech by the Sponsor | Zhou Zhengru, OE qiche, General Manager |
| 10:10-10:40 | Al Times -Automotive and Semiconductor Industries Empowered by Artificial Intelligence | Zhang Shuqiao, SAIC Motor Corporation Limited, Professor-level Senior Engineer |
| 10:40-11:10 | Thermal Management Revolution of Efficient Electric Drive System | Schaeffler |
| 11:10-11:40 | SiCPower Devices: Core Chip Technology Solutions to Reshape the New Energy Landscape | Ni Xuanwei, Alpha Power Solutions (Shanghai) Co., Ltd., Deputy Director of Product Marketing |
| 11:40-12:10 | Key Technologies and Development Trends of New Energy Vehicle Drive Motors | Cui Gang, Huayu Automotive Electric Systems Co., Ltd., Senior Manager of Technical Management Section |
| 13:30-14:00 | Thermal Management System Development for Power Battery Packs | Shan Jiongyi, Pan Asia Technical Automotive Center Co., Ltd, Drive System Thermal Management Architecture Expert |
| 14:00-14:30 | Key Role of Plasma Surface Modification in Electric Drive System Integration | Wu Yajing, Keylink Technology, General Manager |
| 14:30-15:00 | Powering Next-generation Mobility: An End-to-end Test Platform for Electric Vehicles | Shi Yong, Keysight Technologies, Senior Solution Engineer |
| 15:00-15:30 | Silicone Solutions for Next-generation IGBT and SiC Power Modules | Feng Xuewu, Dow, Senior Technical Service and Development Specialist |
| 15:30-16:00 | Automotive-grade SiC MOSSFET Defect Control and Reliability Design for Electric Drive Controllers | Liu Jinwei, Geely Auto Group, Reliability Expert |
© Messe Muenchen Shanghai Co., Ltd.
沪公网安备31011502016746号