In recent years, rapidly emerging trillion-level industries such as automotive electronics, the low-altitude economy, and robotics have driven the swift expansion of China's high-end electronics sector and its adhesive applications. According to relevant statistics, the market size of electronic adhesives in China exceeds 12 billion yuan, with high-end electronic adhesives accounting for over 50% of this total.
To assist adhesive companies in adapting to the high-demand, high-standard, and high-value-added development of the high-end electronic adhesive industry, and to promote the high-quality and efficient growth of China's high-end electronic adhesive sector, productronica Shanghai 2026 has decided to host the "2026 Innovation in Adhesive Materials for Robotics and High-End Electronics Seminar" on March 25th, held concurrently with the exhibition.
| Time | Topic | Guest |
|---|---|---|
| 09:30-10:00 | Morning Registration | |
| 10:00-10:25 | 3M Bonding Solutions for Humanoid Robot Assembly | He Ping, 3M China Limited, Senior Application Development Engineer |
| 10:25-11:20 | Solstice's Thermal Interface Materials for Humanoid Robotics | Liao Shibo, Solstice, Global Product Manager |
| 11:20-11:45 | Parker Lord’s Bonding and Thermal Conductivity Solutions for Humanoid Robots | Luo Suyi, Lord Chemical (Shanghai) Co., Ltd., Business Development Manager |
| 11:45-12:10 | How Do Adhesives Enable the Development of the Robotics Industrial Chain? | Gao Dezhen, Darbond Technology Co., Ltd., Product Manager |
| 12:10-12:35 | The Future of Bonded Robotics: Innovative Solutions for Aishengteng's Materials | Chang Wei, Aishengteng (Zhejiang) New Materials Co., Ltd. (ASTmaterial), Deputy General Manager |
| 13:30-13:55 | New Perspectives on the Development of the Low-Altitude Economy and Robotics Industry and Opportunities and Challenges for Adhesives | Bu Lin, Shanghai Yanya Enterprise Management Consulting Co., Ltd., Consulting Business Director |
| 13:55-14:20 | Polymer selection for high reliability electronic applications | Jiang Ying, MacDermid Alpha, Senior Business Development Engineer |
| 14:20-14:45 | Semiconductor Advanced Packaging Material Solutions for Hangzhou Zhijiang | Jiang Chao, Hangzhou Zhijiang Advanced Material Co., ltd., Senior Research Scientist |
| 14:45-15:10 | Thermal Conductive Gel Applications and Technology Development Trends in Future Consumer Electronics | Zheng Yan, Dow, Senior Research Scientist |
| 15:10-15:35 | Applications of High-Performance Adhesives in Smart Electronic Devices | Li Ting, DiMa New Material Technologies (Soochow) Co., Ltd., Director |
| 15:35-16:00 | Development and Application of Two-Component Acrylate Structural Adhesives in the Electronics Market | Wu Liang, Kangda New Materials (Group) Co., Ltd., R&D Engineer |
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