In recent years, the rapid development of emerging industries like 5G, artificial intelligence, smartphones, new energy vehicles, and the Internet of Things has driven substantial growth in China's high-end electronics and its adhesive industry. With an estimated overall electronic adhesive consumption of around 12 billion yuan in 2022, high-end electronic adhesives, encompassing semiconductors, new displays, automotive electronics, and smart driving, constitute over 50% of this consumption.
To navigate this historical opportunity, glue companies need to adapt to the high requirements, standards, and added value demand of the rapidly evolving high-end electronic glue industry. The 2024 High-end Electronic Adhesive Material Technology Innovation Seminar and 2024 Advanced Electronic Dispensing and Adhesive Technology Forum aim to help glue enterprises accurately grasp the latest trends and opportunities in China's high-end electronic glue market, fostering the rapid and high-quality development of the industry.
Time | Topic | Guest |
---|---|---|
10:00 - 10:30 | Host's Opening Speech | |
10:30 - 11:00 | Momentive Electronic Adhesive Solutions | Lei Ma Maitu Marketing Manager |
11:30 - 12:00 | Adhesive Applications and Solutions for the Display Industry | Jiangxin Liu Crown New Materials Marketing Manager |
13:30 - 14:00 | IGBT High-Temperature Resistance and Low Volatility Silicone Potting Adhesive | Yi Zhao Zhejiang LinkTech Silicone Materials Ltd. VP of Technology |
14:00 - 14:30 | Dow’s silicone solutions for renewable energy industry | Feng Xuewu Dow Senior Technical Service and Development Expert |
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