China International SiP Forum

Room M17 (2nd floor) in Hall E2
  • How EMS Breaks through the SiP Trend

Time Topic Guest
Time TopicInteractive Communication Guest

Time TopicThe Requirement for IC And the Packaging Technology Guest

Dr. Yifan Guo
ASE Technology Deputy General Manager

Time TopicTBD Guest

Lei Shi
Tongfu Microelectronics Co., Ltd. General Manager

Time TopicBottlenecks And Solutions in SiP Applications Guest

Weiwei Tang
MooreElite Vice President of Packaging

Time TopicPanel Discussion Guest

  • How EMS Breaks through the SiP Trend

Time Topic Guest
Time TopicAdvanced Process Deveolopment for System-Like HD SiP Guest

Mike Zhao
Universal Scientific Industrial (Shanghai) Co., Ltd. VP of Miniaturization x Modularized x Manufacturing & System in Module BU (Group)

Time TopicSiP in Memory Guest

George Xu
Payton Technology (Shenzhen) Co., Ltd. Sr R&D and Process Manager

Time TopicMeeting the Challenges in High Volume System-in-Package Production Guest

Tan Peng Fui
ASM Assembly Systems Senior Manager Global Product Marketing

Time TopicAT&S All in One Package Solution Guest

Lio Li
AT&S (China) Company Ltd. Product Management Manager

Time TopicLow stand-off Cleaning & No-clean Solder Paste Cleaning Guest

Jerry Ji
Zestron Senior Application Technology Engineer

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