Wide Bandgap Semiconductor Advanced Packaging Technology Industry

Wide Bandgap Semiconductor Advanced Packaging Technology Industry Chain Technical Seminar & Industry Summit Forum

Time： Thursday, March 26, 2026 10:00 AM - 5:00 PM

Venue： Meeting Room E4-M27

Organiser： Messe Muenchen Shanghai Co., Ltd.

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2024 展会回顾

Forum Introduction

2025–2030 marks a "Golden Era" for the global Silicon Carbide (SiC) power device market. No longer solely reliant on electric vehicles, growth is now fueled by a diversified landscape including data centers, industrial automation, and energy sectors. The packaging technology of embedding SiC power devices directly into printed circuit boards (PCBs) represents a forward-looking exploration in the current field of power electronics. The discussion will delve into dimensions including the demand for performance breakthroughs, the evolution of packaging technologies, advancements in materials science, and trends in system integration.

key topics

Technical Breakthroughs: Next-Gen Interconnection Technologies, Advanced Thermal Management Solutions, Packaging Architecture & Material Innovation, Embedded Cavity Design
Supply Chain Collaboration: Standardisation and Testing Methods, Cost Control and Yield Enhancement, Equipment-Process Synergy, Design Tools and Simulation
New Application Frontiers: Electric Drive Systems for New Energy Vehicles, AI Computing Power and Data Centers, Energy Infrastructure

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Wide Bandgap Semiconductor Advanced Packaging Technology Industry Chain Technical Seminar & Industry Summit Forum