Cloud-Edge-Device Collaboration & Liquid Cooling Revolution: Empo

"Cloud-Edge-Device Collaboration & Liquid Cooling Revolution: Empowering Industrial Applications of Embodied AI" Forum

Time： Thursday, March 26, 2026 10:00 AM - 5:00 PM

Venue： Meeting Room W3-M10

Organiser： Messe Muenchen Shanghai Co., Ltd.

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Forum Introduction

Bringing together industry, academia, and research experts to explore innovations in computing power, algorithms, and thermal management, and to scale Embodied AI across industrial, service, healthcare, and energy sectors.

key topics

The "Nerve Center" of Embodied AI: Top-Level Design and Implementation of Cloud-Edge-Device Collaborative Architecture
Evolution of the "Brain": Challenges and Breakthroughs in Cloud Training and Edge Deployment of Large AI Models
Cooling the "Fever" of Computing Power: Liquid Cooling Solutions for High-Density Computing Bottlenecks
Bridging Cloud and Edge: Delivering Deterministic Connectivity for Embodied AI via 5G+MEC Networks
The Roadmap and Future of Embodied AI: From Research Labs to "Lighthouse Factories" “Sub-Zero” Computing: Liquid-Cooled Edge Servers Empowering Industrial Robot Clusters
Pushing the Limits of "Joints": Thermal Management Innovations for High-Power-Density Humanoid Actuators
From Thermal Management to “Cold” Power: How Liquid-Cooled Joint Modules Unlock Reliable Performance for Embodied AI

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"Cloud-Edge-Device Collaboration & Liquid Cooling Revolution: Empowering Industrial Applications of Embodied AI" Forum

"Cloud-Edge-Device Collaboration & Liquid Cooling Revolution: Empowering Industrial Applications of Embodied AI" Forum

Forum Introduction

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